TSPC860MHVZPU50B
vs
MPC860SRCZP50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
Package Description
,
Pin Count
357
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
Low Power Mode
YES
Number of Terminals
357
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Position
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
3
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