TSPC860MHMZPU50C1
vs
MPC860TCVR50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
Pin Count
357
357
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
357
357
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
2.52 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Pbfree Code
Rohs Code
JESD-609 Code
e1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA357,19X19,50
Peak Reflow Temperature (Cel)
245
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
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