TSPC860MHMZPU50C1
vs
MPC860SRCZP50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Ihs Manufacturer
ATMEL CORP
Part Package Code
BGA
Package Description
BGA,
Pin Count
357
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
Length
25 mm
Low Power Mode
YES
Number of Terminals
357
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.05 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
1
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