TSPC860MHMZPU40C
vs
TS(X)PC860MHMGB/C66(A)
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ATMEL CORP
|
THOMSON-CSF SEMICONDUCTORS
|
| Package Description |
BGA, BGA357,19X19,50
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XBGA-B357
|
S-CBGA-B357
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
357
|
357
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
BGA357,19X19,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
357
|
| ECCN Code |
|
3A001.A.2.C
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
NO
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
NO
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Speed |
|
66 MHz
|
| Technology |
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
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