TSPC860MHMGU/T50C
vs
TSPC860MHVZP40A3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
BGA
Package Description
,
,
Pin Count
357
357
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
40 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B357
S-PBGA-B357
Low Power Mode
NO
NO
Number of Terminals
357
357
Operating Temperature-Max
125 °C
110 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
50 MHz
40 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Compare TSPC860MHMGU/T50C with alternatives
Compare TSPC860MHVZP40A3 with alternatives