TSPC750AVGSU12LH
vs
IBM25PPC750-DB0M2660
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL CORP
|
IBM MICROELECTRONICS
|
| Part Package Code |
CGA
|
BGA
|
| Package Description |
CGA,
|
BGA, BGA360,19X19,50
|
| Pin Count |
360
|
360
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
83.3 MHz
|
83.3 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-CBGA-X360
|
S-CBGA-B360
|
| Length |
25 mm
|
25 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
|
| Number of Terminals |
360
|
360
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
CGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
3.2 mm
|
| Speed |
266 MHz
|
266 MHz
|
| Supply Voltage-Max |
2.7 V
|
2.75 V
|
| Supply Voltage-Min |
2.5 V
|
2.65 V
|
| Supply Voltage-Nom |
2.6 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
UNSPECIFIED
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
25 mm
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
65 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA360,19X19,50
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TSPC750AVGSU12LH with alternatives
Compare IBM25PPC750-DB0M2660 with alternatives