TSPC750AMG10LH
vs
TSPC750AMGU10LE
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
ATMEL GRENOBLE
|
Part Package Code |
BGA
|
BGA
|
Package Description |
,
|
,
|
Pin Count |
360
|
360
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
83.3 MHz
|
83.3 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-CBGA-B360
|
S-CBGA-B360
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
360
|
360
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
233 MHz
|
233 MHz
|
Supply Voltage-Max |
2.7 V
|
2.7 V
|
Supply Voltage-Min |
2.5 V
|
2.5 V
|
Supply Voltage-Nom |
2.6 V
|
2.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TSPC750AMG10LH with alternatives
Compare TSPC750AMGU10LE with alternatives