TSPC740AMGB/T12LE
vs
TSXPC740AMGB/Q12LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
,
BGA,
Pin Count
255
255
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
83.3 MHz
83.3 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B255
S-CBGA-B255
Low Power Mode
YES
YES
Number of Terminals
255
255
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883 Class B
Speed
266 MHz
266 MHz
Supply Voltage-Max
2.7 V
2.7 V
Supply Voltage-Min
2.5 V
2.5 V
Supply Voltage-Nom
2.6 V
2.6 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Length
21 mm
Seated Height-Max
3 mm
Terminal Pitch
1.27 mm
Width
21 mm
Compare TSPC740AMGB/T12LE with alternatives
Compare TSXPC740AMGB/Q12LE with alternatives