TSPC603RMAB/Q10LC
vs
TSPC603RCA10LC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
THOMSON-CSF SEMICONDUCTORS
Part Package Code
QFP
QFP
Package Description
,
,
Pin Count
240
240
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-GQFP-G240
S-GQFP-G240
Low Power Mode
YES
YES
Number of Terminals
240
240
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Speed
233 MHz
233 MHz
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
Compare TSPC603RMAB/Q10LC with alternatives
Compare TSPC603RCA10LC with alternatives