TSPC603EMGB/T3LL
vs
TSPC603PVGU/T8LE
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
THOMSON-CSF COMPSANTS SPECIFIC
|
| Package Description |
,
|
BGA, BGA255,16X16,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
2
|
3
|
| Bit Size |
|
32
|
| JESD-30 Code |
|
S-PBGA-B255
|
| Number of Terminals |
|
255
|
| Operating Temperature-Max |
|
110 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA255,16X16,50
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Speed |
|
200 MHz
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|