TSPC603EMGB/T3LL
vs
IBM25EMPPC603E2BB200K
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
IBM MICROELECTRONICS
|
| Package Description |
,
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
255
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
66.67 MHz
|
| External Data Bus Width |
|
64
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
NO
|
| JESD-30 Code |
|
S-CBGA-B255
|
| Length |
|
21 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
255
|
| Operating Temperature-Max |
|
40 °C
|
| Operating Temperature-Min |
|
10 °C
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
BGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3 mm
|
| Speed |
|
200 MHz
|
| Supply Voltage-Max |
|
2.625 V
|
| Supply Voltage-Min |
|
2.375 V
|
| Supply Voltage-Nom |
|
2.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
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