TSPC106AVGU66CG
vs
TSPC106AVGSB/Q66CE
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ATMEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
BGA
|
CGA
|
| Package Description |
21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-303
|
CGA,
|
| Pin Count |
303
|
303
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Address Bus Width |
32
|
32
|
| Bus Compatibility |
60X; POWERPC 601; POWERPC 603; POWERPC 604
|
60X; POWERPC 601; POWERPC 603; POWERPC 604
|
| Clock Frequency-Max |
66 MHz
|
66 MHz
|
| External Data Bus Width |
64
|
64
|
| JESD-30 Code |
R-CBGA-B303
|
R-CBGA-X303
|
| JESD-609 Code |
e0
|
|
| Length |
25 mm
|
25 mm
|
| Number of Terminals |
303
|
303
|
| Operating Temperature-Max |
110 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
CGA
|
| Package Equivalence Code |
BGA303,19X16,50
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.16 mm
|
3.84 mm
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
UNSPECIFIED
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, PCI
|
BUS CONTROLLER, PCI
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare TSPC106AVGU66CG with alternatives
Compare TSPC106AVGSB/Q66CE with alternatives