TSN2BJ110
vs
RAVF104D115%R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TATEYAMA KAGAKU GROUP
|
STACKPOLE ELECTRONICS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.35 mm
|
|
| Package Length |
2 mm
|
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1 mm
|
|
| Packing Method |
Bulk
|
TR
|
| Rated Power Dissipation (P) |
0.063 W
|
0.25 W
|
| Resistance |
11 Ω
|
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
0804
|
0804
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
25 V
|
25 V
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
CHIP, ROHS COMPLIANT
|
| HTS Code |
|
8533.21.00.20
|
| Element Power Dissipation |
|
0.063 W
|
| First Element Resistance |
|
11 Ω
|
| JESD-609 Code |
|
e3
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Elements |
|
1
|
| Number of Functions |
|
4
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare TSN2BJ110 with alternatives
Compare RAVF104D115%R with alternatives