TSC80C31-12MG/883 vs 87C51/BQA feature comparison

TSC80C31-12MG/883 Temic Semiconductors

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87C51/BQA NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS NXP SEMICONDUCTORS
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T40 R-GDIP-T40
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
PWM Channels NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Qualification Status Not Qualified Not Qualified
ROM (words) 0
ROM Programmability ROM LESS OTPROM
Screening Level MIL-STD-883
Speed 12 MHz
Supply Current-Max 15.8 mA
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 2
Part Package Code DIP
Package Description CERAMIC, DIP-40
Pin Count 40
HTS Code 8542.31.00.01
Seated Height-Max 5.715 mm
Terminal Pitch 2.54 mm
Width 15.24 mm

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