TSB80C186EB20 vs SB80C186XL20 feature comparison

TSB80C186EB20 Intel Corporation

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SB80C186XL20 Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP ROCHESTER ELECTRONICS LLC
Part Package Code QFP QFP
Package Description LFQFP, LFQFP,
Pin Count 80 80
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 S-PQFP-G80
Length 12 mm 12 mm
Low Power Mode YES YES
Number of DMA Channels
Number of External Interrupts 6
Number of Serial I/Os 2
Number of Terminals 80 80
On Chip Data RAM Width
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 1.66 mm 1.66 mm
Speed 20 MHz 20 MHz
Supply Current-Max 108 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare SB80C186XL20 with alternatives