TS932BIN
vs
LMC6572AIN
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP8,.3
|
DIP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.00015 µA
|
|
| Bias Current-Max (IIB) @25C |
0.00015 µA
|
|
| Common-mode Reject Ratio-Nom |
85 dB
|
75 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
2000 µV
|
3500 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
|
| Micropower |
YES
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Packing Method |
TUBE
|
|
| Power |
NO
|
|
| Programmable Power |
NO
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.8 mm
|
5.08 mm
|
| Slew Rate-Nom |
0.5 V/us
|
90000 V/us
|
| Supply Current-Max |
0.066 mA
|
|
| Supply Voltage Limit-Max |
12 V
|
12 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
100
|
220
|
| Wideband |
NO
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
9.767 mm
|
|
|
|
Compare TS932BIN with alternatives
Compare LMC6572AIN with alternatives