TS932AIN
vs
TLC271IDRG4
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
TEXAS INSTRUMENTS INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
SOP, SOP8,.25
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00015 µA
0.00006 µA
Bias Current-Max (IIB) @25C
0.00015 µA
0.00006 µA
Common-mode Reject Ratio-Nom
85 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5000 µV
13000 µV
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e4
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
NO
Number of Functions
2
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Packing Method
TUBE
TR
Power
NO
NO
Programmable Power
NO
YES
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.8 mm
1.75 mm
Slew Rate-Nom
0.5 V/us
3.6 V/us
Supply Current-Max
0.066 mA
1.6 mA
Supply Voltage Limit-Max
12 V
18 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
NO
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
100
1700
Wideband
NO
NO
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Samacsys Manufacturer
Texas Instruments
Common-mode Reject Ratio-Min
65 dB
Input Offset Current-Max (IIO)
0.00006 µA
Length
4.9 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Voltage Gain-Min
10000
Compare TS932AIN with alternatives
Compare TLC271IDRG4 with alternatives