TS932AIN vs TLC271IDRG4 feature comparison

TS932AIN STMicroelectronics

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TLC271IDRG4 Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP8,.3 SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00015 µA 0.00006 µA
Bias Current-Max (IIB) @25C 0.00015 µA 0.00006 µA
Common-mode Reject Ratio-Nom 85 dB 80 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 5000 µV 13000 µV
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e4
Low-Bias YES YES
Low-Offset NO NO
Micropower YES NO
Number of Functions 2 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TUBE TR
Power NO NO
Programmable Power NO YES
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.8 mm 1.75 mm
Slew Rate-Nom 0.5 V/us 3.6 V/us
Supply Current-Max 0.066 mA 1.6 mA
Supply Voltage Limit-Max 12 V 18 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO YES
Technology BICMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 100 1700
Wideband NO NO
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Samacsys Manufacturer Texas Instruments
Common-mode Reject Ratio-Min 65 dB
Input Offset Current-Max (IIO) 0.00006 µA
Length 4.9 mm
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 10000

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