TS87C52X2-MCEB
vs
TS87C52X2-MCE
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
ATMEL CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LQFP, QFP44,.47SQ,32
|
VQFP-44
|
Pin Count |
44
|
44
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
JESD-609 Code |
e0
|
|
Length |
10 mm
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
44
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
QFP
|
Package Equivalence Code |
QFP44,.47SQ,32
|
QFP44,.47SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
256
|
256
|
ROM (words) |
8192
|
8192
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
1.6 mm
|
|
Speed |
40 MHz
|
40 MHz
|
Supply Current-Max |
39 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
10 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
1
|
|
|
|
Compare TS87C52X2-MCEB with alternatives
Compare TS87C52X2-MCE with alternatives