TS80L186EB-8
vs
SB80C188-25
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
TFQFP, TQFP80,.55SQ
|
Pin Count |
80
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
Address Bus Width |
20
|
20
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
16 MHz
|
50 MHz
|
External Data Bus Width |
16
|
8
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
R-PQFP-G80
|
S-PQFP-G80
|
Length |
20 mm
|
12 mm
|
Low Power Mode |
YES
|
YES
|
Number of DMA Channels |
|
2
|
Number of External Interrupts |
6
|
5
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
80
|
80
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
TFQFP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
3.15 mm
|
1.2 mm
|
Speed |
8 MHz
|
25 MHz
|
Supply Current-Max |
45 mA
|
125 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
12 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
3A991.A.2
|
HTS Code |
|
8542.31.00.01
|
Additional Feature |
|
DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
TQFP80,.55SQ
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TS80L186EB-8 with alternatives
Compare SB80C188-25 with alternatives