TS80C31X2-MCB
vs
TS80C31X2-MIB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ATMEL CORP
|
TEMIC SEMICONDUCTORS
|
Part Package Code |
LCC
|
|
Package Description |
PLASTIC, LCC-44
|
PLASTIC, LCC-44
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Samacsys Manufacturer |
Microchip
|
|
Has ADC |
NO
|
NO
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
8051
|
8051
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
Moisture Sensitivity Level |
1
|
|
Number of I/O Lines |
32
|
32
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC44,.7SQ
|
LDCC44,.7SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
128
|
128
|
Speed |
40 MHz
|
40 MHz
|
Supply Current-Max |
27 mA
|
27 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
3
|
3
|
JESD-609 Code |
|
e0
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TS80C31X2-MCB with alternatives