TS68EN360VR25L
vs
TS68EN360MRB/C33
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
THOMSON-CSF SEMICONDUCTORS
Part Package Code
PGA
PGA
Package Description
CERAMIC, PGA-241
,
Pin Count
241
241
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
25 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-CPGA-P241
S-CPGA-P241
Length
47.245 mm
Low Power Mode
YES
Number of Terminals
241
241
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.96 mm
Speed
25 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
47.245 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
Screening Level
MIL-STD-883
Compare TS68EN360VR25L with alternatives
Compare TS68EN360MRB/C33 with alternatives