TS68EN360MRB/C25L
vs
TS68EN360MR1B/C25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ATMEL CORP
THOMSON-CSF COMPSANTS SPECIFIC
Part Package Code
PGA
Package Description
PGA, PGA241M,18X18
PGA, PGA241M,18X18
Pin Count
241
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CPGA-P241
S-CPGA-P241
JESD-609 Code
e0
e0
Length
47.245 mm
Number of Terminals
241
241
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA241M,18X18
PGA241M,18X18
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
38535Q/M;38534H;883B
Seated Height-Max
4.96 mm
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
47.245 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
2
3
Supply Current-Max
250 mA
Compare TS68EN360MRB/C25L with alternatives