TS68EN360MR1B/C33L
vs
TS68EN360MRB/Q25L
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
CAVITY UP, CERAMIC, PGA-241
|
PGA,
|
| Pin Count |
241
|
241
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-CPGA-P241
|
S-CPGA-P241
|
| Length |
47.245 mm
|
47.245 mm
|
| Number of Terminals |
241
|
241
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
4.96 mm
|
4.96 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
47.245 mm
|
47.245 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
25 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| JESD-609 Code |
|
e4
|
| Low Power Mode |
|
YES
|
| Speed |
|
25 MHz
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare TS68EN360MR1B/C33L with alternatives
Compare TS68EN360MRB/Q25L with alternatives