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TS68EN360MR1B/C25L vs 5962-9760702MXC feature comparison

TS68EN360MR1B/C25L Atmel Corporation

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5962-9760702MXC Thomson-CSF Compsants Specific

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP THOMSON-CSF COMPSANTS SPECIFIC
Part Package Code PGA
Package Description PGA, PGA, PGA241M,18X18
Pin Count 241
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P241 S-CPGA-P241
Length 47.245 mm
Number of Terminals 241 241
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B 38535Q/M;38534H;883B
Seated Height-Max 4.96 mm
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 47.245 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Base Number Matches 2 5
Package Equivalence Code PGA241M,18X18
Microcontrollers and Processors » Microprocessors
Microcontrollers and Processors » Other uPs/uCs/Peripheral ICs

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