TS68EN360DES01MXCL vs TS68EN360VR33L feature comparison

TS68EN360DES01MXCL Atmel Corporation

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TS68EN360VR33L Atmel Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ATMEL CORP ATMEL CORP
Part Package Code PGA PGA
Package Description PGA, PGA, PGA241M,18X18
Pin Count 241 241
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P241 S-CPGA-P241
Length 47.245 mm 47.245 mm
Number of Terminals 241 241
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.96 mm 4.96 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 47.245 mm 47.245 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Rohs Code No
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 33 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache NO
JESD-609 Code e0
Low Power Mode YES
Package Equivalence Code PGA241M,18X18
Speed 33 MHz
Terminal Finish Tin/Lead (Sn/Pb)

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