TS68C000VE8A
vs
MC68HC001FN8R2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
FREESCALE SEMICONDUCTOR INC
Part Package Code
LCC
LCC
Package Description
HQCCN, LCC68,.95SQ
QCCJ, LDCC68,1.0SQ
Pin Count
68
68
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
24
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
8 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CQCC-N68
S-PQCC-J68
Length
24.13 mm
Low Power Mode
NO
NO
Number of Terminals
68
68
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
HQCCN
QCCJ
Package Equivalence Code
LCC68,.95SQ
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Speed
8 MHz
8 MHz
Supply Current-Max
42 mA
25 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
3
ECCN Code
EAR99
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
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Compare MC68HC001FN8R2 with alternatives