TS68C000VC112.5A
vs
5962-8946203MYA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
E2V TECHNOLOGIES PLC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP64,.9
Pin Count
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
24
Bit Size
32
32
Boundary Scan
NO
Clock Frequency-Max
12.5 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-CDIP-T64
R-XDIP-T64
Length
81.28 mm
Low Power Mode
NO
Number of Terminals
64
64
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.83 mm
Speed
12.5 MHz
12.5 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HCMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
6
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP64,.9
Power Supplies
5 V
Screening Level
38535Q/M;38534H;883B
Supply Current-Max
45 mA
Terminal Finish
Tin/Lead (Sn/Pb)
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