TS68C000VC112.5A
vs
5962-8946203MYA
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
DIP, DIP64,.9
|
Pin Count |
64
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
24
|
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
12.5 MHz
|
|
External Data Bus Width |
16
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-CDIP-T64
|
R-XDIP-T64
|
Length |
81.28 mm
|
|
Low Power Mode |
NO
|
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.83 mm
|
|
Speed |
12.5 MHz
|
12.5 MHz
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
22.86 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
6
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Equivalence Code |
|
DIP64,.9
|
Power Supplies |
|
5 V
|
Screening Level |
|
38535Q/M;38534H;883B
|
Supply Current-Max |
|
45 mA
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TS68C000VC112.5A with alternatives