TS68C000DESC02MXA
vs
TSX68C000VE1B/C8A
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
LCC
|
LCC
|
Package Description |
,
|
HQCCN,
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
10 MHz
|
8 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CQCC-N68
|
S-CQCC-N68
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
MIL-STD-883 Class B
|
Speed |
10 MHz
|
8 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
3
|
1
|
Length |
|
24.13 mm
|
Low Power Mode |
|
NO
|
Package Code |
|
HQCCN
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
24.13 mm
|
|
|
|
Compare TS68C000DESC02MXA with alternatives
Compare TSX68C000VE1B/C8A with alternatives