TS68882VF33
vs
TS68882MR8B/Y25
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
E2V TECHNOLOGIES PLC
|
| Part Package Code |
QFP
|
PGA
|
| Package Description |
,
|
PGA,
|
| Pin Count |
68
|
68
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-CQFP-G68
|
S-CPGA-P68
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
5
|
3
|
| ECCN Code |
|
3A001.A.2.C
|
| Length |
|
26.92 mm
|
| Package Code |
|
PGA
|
| Seated Height-Max |
|
4.184 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
26.92 mm
|
|
|
|
Compare TS68882VF33 with alternatives
Compare TS68882MR8B/Y25 with alternatives