TS68882MRB/C25
vs
MC68882FN25A
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF COMPSANTS SPECIFIC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
,
|
LCC-68
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Base Number Matches |
6
|
3
|
Rohs Code |
|
No
|
Part Package Code |
|
LCC
|
Pin Count |
|
68
|
ECCN Code |
|
EAR99
|
Address Bus Width |
|
5
|
Barrel Shifter |
|
YES
|
Boundary Scan |
|
NO
|
Bus Compatibility |
|
MC68882
|
Clock Frequency-Max |
|
25 MHz
|
External Data Bus Width |
|
32
|
JESD-30 Code |
|
S-PQCC-J68
|
JESD-609 Code |
|
e0
|
Length |
|
24.2062 mm
|
Moisture Sensitivity Level |
|
3
|
Number of Terminals |
|
68
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
QCCJ
|
Package Equivalence Code |
|
LDCC68,1.0SQ
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
|
220
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
4.57 mm
|
Supply Voltage-Max |
|
5.25 V
|
Supply Voltage-Min |
|
4.75 V
|
Supply Voltage-Nom |
|
5 V
|
Surface Mount |
|
YES
|
Technology |
|
HCMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
J BEND
|
Terminal Pitch |
|
1.27 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
24.2062 mm
|
uPs/uCs/Peripheral ICs Type |
|
MATH PROCESSOR, COPROCESSOR
|
|
|
|
Compare MC68882FN25A with alternatives