TS68882MR8B/Y20 vs SPAK68882FN25A feature comparison

TS68882MR8B/Y20 e2v technologies

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SPAK68882FN25A Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer E2V TECHNOLOGIES PLC MOTOROLA INC
Part Package Code PGA
Package Description PGA, QCCJ,
Pin Count 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P68 S-PQCC-J68
Length 26.92 mm 24.2062 mm
Number of Terminals 68 68
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code PGA QCCJ
Package Shape SQUARE SQUARE
Package Style GRID ARRAY CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.184 mm 4.57 mm
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS HCMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form PIN/PEG J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position PERPENDICULAR QUAD
Width 26.92 mm 24.2062 mm
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 1
Address Bus Width 5
Boundary Scan NO
Bus Compatibility MC68020; MC68030
Clock Frequency-Max 25 MHz
External Data Bus Width 32

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