TS68882MR8B/Y20 vs 5962-8953401MYX feature comparison

TS68882MR8B/Y20 Thales Group

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5962-8953401MYX Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS INTEL CORP
Part Package Code PGA QFP
Package Description , QFF,
Pin Count 68 68
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code S-CPGA-P68 S-CQFP-F68
Number of Terminals 68 68
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK
Qualification Status Not Qualified Not Qualified
Screening Level CECC90000B MIL-STD-883 Class B
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form PIN/PEG FLAT
Terminal Position PERPENDICULAR QUAD
uPs/uCs/Peripheral ICs Type MATH PROCESSOR, COPROCESSOR MATH PROCESSOR, COPROCESSOR
Base Number Matches 1 1
Address Bus Width
Boundary Scan NO
Clock Frequency-Max 16 MHz
External Data Bus Width 32
Length 24.08 mm
Package Code QFF
Seated Height-Max 2.92 mm
Terminal Pitch 1.27 mm
Width 24.08 mm

Compare TS68882MR8B/Y20 with alternatives

Compare 5962-8953401MYX with alternatives