TS68882MR33
vs
MC68882FN33
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
E2V TECHNOLOGIES PLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
PGA
|
|
| Package Description |
PGA, PGA68,10X10
|
PLASTIC, LCC-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
5
|
5
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
33 MHz
|
33.33 MHz
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-CPGA-P68
|
S-PQCC-J68
|
| Length |
26.92 mm
|
24.205 mm
|
| Number of Terminals |
68
|
68
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Equivalence Code |
PGA68,10X10
|
LDCC68,1.0SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
4.184 mm
|
4.57 mm
|
| Supply Current-Max |
136 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Width |
26.92 mm
|
24.205 mm
|
| uPs/uCs/Peripheral ICs Type |
MATH PROCESSOR, COPROCESSOR
|
MATH PROCESSOR, COPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Barrel Shifter |
|
YES
|
| Bus Compatibility |
|
MC68882
|
|
|
|
Compare TS68882MR33 with alternatives
Compare MC68882FN33 with alternatives