TS68882DESC04XA
vs
TS68882VF20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
THOMSON-CSF SEMICONDUCTORS
Part Package Code
PGA
QFP
Package Description
,
CERAMIC, QFP-68
Pin Count
68
68
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-CPGA-P68
S-CQFP-G68
Number of Terminals
68
68
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
PIN/PEG
GULL WING
Terminal Position
PERPENDICULAR
QUAD
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
1
1
Compare TS68882DESC04XA with alternatives
Compare TS68882VF20 with alternatives