TS68008VFN10
vs
Z0800106LME
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
ZILOG INC
|
Part Package Code |
LCC
|
LCC
|
Package Description |
PLASTIC, LCC-52
|
QCCN, LCC52,.75SQ
|
Pin Count |
52
|
52
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
22
|
16
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
10 MHz
|
6 MHz
|
External Data Bus Width |
8
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQCC-J52
|
S-CQCC-N52
|
JESD-609 Code |
e0
|
e0
|
Length |
19.1262 mm
|
19.05 mm
|
Low Power Mode |
NO
|
YES
|
Number of DMA Channels |
|
|
Number of External Interrupts |
7
|
3
|
Number of Serial I/Os |
|
|
Number of Terminals |
52
|
52
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
QCCN
|
Package Equivalence Code |
LDCC52,.8SQ
|
LCC52,.75SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Seated Height-Max |
5.08 mm
|
2.61 mm
|
Speed |
10 MHz
|
6 MHz
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
NMOS
|
NMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
19.1262 mm
|
19.05 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A001.A.2.C
|
Supply Current-Max |
|
400 mA
|
|
|
|
Compare TS68008VFN10 with alternatives
Compare Z0800106LME with alternatives