TS68000CP8
vs
5962-8766501XX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
THOMSON COMPONENTS-MOSTEK CORP
PYRAMID SEMICONDUCTOR CORP
Package Description
DIP-64
DIP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
16
JESD-30 Code
R-PDIP-T64
R-XDIP-T64
JESD-609 Code
e0
Number of Terminals
64
64
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP64,.9
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
8 MHz
15 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
1
Pbfree Code
Part Package Code
DIP
Pin Count
64
ECCN Code
3A001.A.2.C
Address Bus Width
16
Boundary Scan
NO
Clock Frequency-Max
15 MHz
External Data Bus Width
16
Format
FLOATING POINT
Integrated Cache
NO
Length
42.2402 mm
Low Power Mode
YES
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883 Class B
Seated Height-Max
4.191 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
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