TS5A23166DCURG4
vs
NX3L2G384GM
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
QFN
|
Package Description |
VSSOP, TSSOP8,.12,20
|
VQCCN, LCC8,.06SQ,20
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
Analog IC - Other Type |
SPST
|
SPST
|
Bandwidth-Nom |
150 MHz
|
|
Input Voltage-Max |
5.5 V
|
|
Input Voltage-Min |
|
|
JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N8
|
JESD-609 Code |
e4
|
e4
|
Length |
2.3 mm
|
1.6 mm
|
Moisture Sensitivity Level |
1
|
1
|
Normal Position |
NO
|
|
Number of Channels |
2
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Off-state Isolation-Nom |
62 dB
|
90 dB
|
On-state Resistance Match-Nom |
0.04 Ω
|
0.04 Ω
|
On-state Resistance-Max (Ron) |
4 Ω
|
1.7 Ω
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VQCCN
|
Package Equivalence Code |
TSSOP8,.12,20
|
LCC8,.06SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
0.5 mm
|
Supply Current-Max (Isup) |
0.001 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
4.3 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
1.4 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.65 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
15.5 ns
|
21 ns
|
Switch-on Time-Max |
18 ns
|
48 ns
|
Switching |
MAKE-BEFORE-BREAK
|
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
2 mm
|
1.6 mm
|
Base Number Matches |
1
|
1
|
Technology |
|
CMOS
|
|
|
|
Compare TS5A23166DCURG4 with alternatives
Compare NX3L2G384GM with alternatives