TS556CN
vs
TS555CPT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
PLASTIC, DIP-14
|
TSSOP, TSSOP8,.25
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Additional Feature |
IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY
|
IT CAN ALSO OPERATE FROM A 2V, 5V AND 12V NOMINAL SUPPLY
|
| Analog IC - Other Type |
PULSE; RECTANGULAR
|
PULSE; RECTANGULAR
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Frequency-Max |
2 MHz
|
2 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP14,.3
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.1 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
1
|
3
|
| Length |
|
4.4 mm
|
|
|
|
Compare TS556CN with alternatives
Compare TS555CPT with alternatives