TS3A26746EYZPR
vs
TLV321AC37IN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
DIP
|
| Package Description |
DSBGA-6
|
DIP,
|
| Pin Count |
6
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| JESD-30 Code |
R-XBGA-B6
|
R-PDIP-T20
|
| JESD-609 Code |
e1
|
|
| Length |
1.4 mm
|
24.325 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
5.08 mm
|
| Supply Current-Max |
0.05 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
NO
|
| Telecom IC Type |
BASEBAND CIRCUIT
|
BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
0.9 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare TS3A26746EYZPR with alternatives
Compare TLV321AC37IN with alternatives