TS3A26746EYZPR
vs
TLV321AC36IDW
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
DSBGA-6
|
SOP,
|
Pin Count |
6
|
20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
JESD-30 Code |
R-XBGA-B6
|
R-PDSO-G20
|
JESD-609 Code |
e1
|
|
Length |
1.4 mm
|
12.8 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
2
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
2.65 mm
|
Supply Current-Max |
0.05 mA
|
|
Supply Voltage-Nom |
3.3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
BASEBAND CIRCUIT
|
BASEBAND CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
0.9 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Technology |
|
CMOS
|
|
|
|
Compare TS3A26746EYZPR with alternatives
Compare TLV321AC36IDW with alternatives