TS27M2CN
vs
TS27M2AID
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
ROHS COMPLIANT, MICRO, PLASTIC, SOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00015 µA
0.0003 µA
Common-mode Reject Ratio-Nom
80 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
12000 µV
6500 µV
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e4
Length
9.27 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP8,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.33 mm
1.75 mm
Slew Rate-Nom
0.6 V/us
0.6 V/us
Supply Current-Max
0.5 mA
0.6 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
10 V
10 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
1000
Voltage Gain-Min
20000
10000
Wideband
NO
NO
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare TS27M2CN with alternatives
Compare TS27M2AID with alternatives