TS27L2AIN
vs
TS27M2AIP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
SOIC
Package Description
DIP, DIP8,.3
TSSOP, TSSOP8,.25
Pin Count
8
8
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.0003 µA
0.0003 µA
Common-mode Reject Ratio-Nom
80 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
6500 µV
6500 µV
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e0
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP8,.3
TSSOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.2 mm
Slew Rate-Nom
0.04 V/us
0.6 V/us
Supply Current-Max
0.036 mA
0.6 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
10 V
10 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
100
1000
Voltage Gain-Min
40000
10000
Wideband
NO
NO
Width
7.62 mm
3 mm
Base Number Matches
1
1
Pbfree Code
Length
4.4 mm
Compare TS27L2AIN with alternatives
Compare TS27M2AIP with alternatives