TS(X)PC860MHVGU66(A)
vs
TS(X)PC860MHVGU40B
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
THOMSON-CSF SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Package Description |
,
|
,
|
Pin Count |
357
|
357
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
YES
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CBGA-B357
|
S-CBGA-B357
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
357
|
357
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
66 MHz
|
40 MHz
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
3A991.A.2
|
Clock Frequency-Max |
|
40 MHz
|
Operating Temperature-Max |
|
110 °C
|
Operating Temperature-Min |
|
-40 °C
|
Supply Voltage-Max |
|
3.465 V
|
Supply Voltage-Min |
|
3.135 V
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare TS(X)PC860MHVGU66(A) with alternatives
Compare TS(X)PC860MHVGU40B with alternatives