TS(X)PC860MHVGU40(A)
vs
XPC860ENZP50C1
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ATMEL GRENOBLE
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
BGA
|
|
| Package Description |
,
|
BGA, BGA357,19X19,50
|
| Pin Count |
357
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
NO
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-CBGA-B357
|
S-PBGA-B357
|
| Low Power Mode |
NO
|
|
| Number of Terminals |
357
|
357
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
40 MHz
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Min |
|
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA357,19X19,50
|
| Power Supplies |
|
3.3 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare TS(X)PC860MHVGU40(A) with alternatives