TS(X)PC860MHVGU/T40(A)
vs
MPC885ZP80
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
,
|
25 X 25 MM, 1.27 MM PITCH, PLASTIC, MS-034BAK-1, BGA-357
|
Pin Count |
357
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
YES
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CBGA-B357
|
S-PBGA-B357
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
357
|
357
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
40 MHz
|
80 MHz
|
Supply Voltage-Nom |
3.3 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
Length |
|
25 mm
|
Package Code |
|
BGA
|
Seated Height-Max |
|
2.52 mm
|
Supply Voltage-Max |
|
1.9 V
|
Supply Voltage-Min |
|
1.7 V
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
25 mm
|
|
|
|
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