TS(X)PC860MHVGB/Q40C
vs
XPC860SRCZP50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
MOTOROLA INC
Part Package Code
BGA
Package Description
,
BGA, BGA357,19X19,50
Pin Count
357
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
40 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B357
S-PBGA-B357
Low Power Mode
NO
Number of Terminals
357
357
Operating Temperature-Max
110 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
40 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
SoC
Base Number Matches
2
3
Rohs Code
Length
25 mm
Package Equivalence Code
BGA357,19X19,50
Seated Height-Max
2.05 mm
Terminal Pitch
1.27 mm
Width
25 mm
Compare TS(X)PC860MHVGB/Q40C with alternatives