TS(X)PC860MHMZPB/Q50A3
vs
XPC860TZP80D3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL GRENOBLE
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
,
BGA, BGA357,19X19,50
Pin Count
357
357
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Low Power Mode
NO
Number of Terminals
357
357
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Speed
50 MHz
Supply Voltage-Max
3.465 V
3.465 V
Supply Voltage-Min
3.135 V
3.135 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
SoC
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Length
25 mm
Package Equivalence Code
BGA357,19X19,50
Seated Height-Max
2.05 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
25 mm
Compare TS(X)PC860MHMZPB/Q50A3 with alternatives
Compare XPC860TZP80D3 with alternatives