TS(X)PC860MHMGU40B vs TS(X)PC860MHMZPB/Q50A3 feature comparison

TS(X)PC860MHMGU40B Thales Group

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TS(X)PC860MHMZPB/Q50A3 Teledyne e2v

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS ATMEL GRENOBLE
Part Package Code BGA BGA
Package Description , ,
Pin Count 357 357
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 50 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-CBGA-B357 S-PBGA-B357
Low Power Mode NO NO
Number of Terminals 357 357
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 40 MHz 50 MHz
Supply Voltage-Max 3.465 V 3.465 V
Supply Voltage-Min 3.135 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 2

Compare TS(X)PC860MHMGU40B with alternatives

Compare TS(X)PC860MHMZPB/Q50A3 with alternatives