TPSMB9.1A
vs
P6SMB9.1AT3G
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TELEFUNKEN MICROELECTRONICS GMBH
|
ONSEMI
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DO-214
|
| Package Description |
|
ROHS COMPLIANT, PLASTIC, CASE 403A-03, SMB, 2 PIN
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
403A-03
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Breakdown Voltage-Max |
|
9.55 V
|
| Breakdown Voltage-Min |
|
8.65 V
|
| Breakdown Voltage-Nom |
|
9.1 V
|
| Clamping Voltage-Max |
|
13.4 V
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JEDEC-95 Code |
|
DO-214AA
|
| JESD-30 Code |
|
R-PDSO-C2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Peak Rev Power Dis-Max |
|
600 W
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Polarity |
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
|
0.55 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Standard |
|
UL RECOGNIZED
|
| Rep Pk Reverse Voltage-Max |
|
7.78 V
|
| Surface Mount |
|
YES
|
| Technology |
|
ZENER
|
| Terminal Finish |
|
TIN
|
| Terminal Form |
|
C BEND
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|