TPS657051YZHR
vs
RFPA2172TR7
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
QORVO INC
|
Part Package Code |
BGA
|
|
Package Description |
0.50 MM PITCH, GREEN, DSBGA-16
|
HQCCN,
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
|
JESD-30 Code |
S-XBGA-B16
|
S-XQCC-N16
|
JESD-609 Code |
e1
|
|
Length |
2.3 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
VFBGA
|
HQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.625 mm
|
1.05 mm
|
Supply Voltage-Nom |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2.3 mm
|
4 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TPS657051YZHR with alternatives
Compare RFPA2172TR7 with alternatives